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Mobile Phone 8 Layer PCB HDI Circuit Boards

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Mobile Phone 8 Layer PCB HDI Circuit Boards

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Brand Name : ABIS

Model Number : HDI-5

Certification : UL, ISO9001,ISO14001,SGS,RoHS, TS16949

Place of Origin : China

MOQ : 1pcs

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal

Supply Ability : 60,000 s.q.m/month

Delivery Time : 0.5-4 week

Packaging Details : Vacuum packing

Material : FR4 Tg150

Layer : 8 layer

App : Mobile phone

Cu weight : 1OZ

Blind vias : Yes

Plated filled vias : Yes

Surface finish : Immersion gold 2u''

PCB thickness : 1mm

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8 Layer PCB HDI Circuit Boards For Mobile Phone


1. 8 layer PCB and immersion gold 2u''.

2. FR4 Tg150 material.

3. Mobile phone industry.

4. Impedance control 50ohm.

5. 0.08mm line track/spacing.


Mobile Phone 8 Layer PCB HDI Circuit Boards​

1 Layer 8 layer
2 Substrate FR4 tg150
3 PCB thickness 1.0mm
4 Application Mobile phone
5 Microvia size 0.12mm
6 Min line copper 0.08mm
7 Min spacing 0.08mm
8 Surface finish Immersion gold 2u''
9 Cu weight 1OZ
10 Solder mask Green LPISM
11 Blind vias Yes
12 Buried vias Yes
13 Certification UL,ISO9001/14001,ISO/TS16949,RoHS,SGS

FAQ

Q1:HDI full name?
A: High density Interconnect.

Q2:High density Interconnect means?
A: HDI with a higher wiring density per unit area than conventional circuit boards,They have finer line and spacing<=0.1mm,smaller vias(<=0.15mm) and capture pads<=0.4mm, and higher connection pad density(>20pads/cm2) than conventional circuit boards.

Q3:What's your quality?
A: All HDI circuit board need test alright and packing security.

Q4: What's your delivery?
A: As for HDI circuit boards,the production time about 4weeks.

Q5: Application field?
A: Telecommunication such as mobile phone,Consumer electronics,Control system and so on.

Q6: Which file required?
A: Gerber file include drill chart.

PCB Examination:

Mobile Phone 8 Layer PCB HDI Circuit BoardsMobile Phone 8 Layer PCB HDI Circuit Boards


Mobile Phone 8 Layer PCB HDI Circuit Boards​


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